Profiling for Successful BGA/CSP Rework


August 14, 2013




This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages....

  • Download Profiling for Successful BGA/CSP Rework article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

Company Information:


Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Adhesives/Dispensing, Manufacturer of Assembly Equipment, Repair/Rework, Soldering

  • Phone 1-714-799-9910
  • Fax 1-714-828-2001

Metcal website

Company Postings:

(23) products in the catalog

(9) technical library articles

(112) news releases

  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Browse Technical Library »

Profiling for Successful BGA/CSP Rework article has been viewed 1069 times


Metcal soldering rework