Dam and Fill Encapsulation for Microelectronic Packages

Published:

August 27, 1999

Author:

Steven J. Adamson and Christian Q. Ness

Abstract:

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective......

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Company Information:

Nordson ASYMTEK

A leader in automated fluid dispensing, jetting and conformal coating. Products range from benchtop dispensers and stand-alone dispensing workstations to fully automated, in-line conveyorized systems.

Carlsbad, California, USA

Adhesives/Dispensing, Assembly, Component Packaging, Manufacturer of Assembly Equipment

  • Phone 760-431-1919
  • Fax 760-431-2678

Nordson ASYMTEK website

Company Postings:

(21) products in the catalog

(10) technical library articles

(49) news releases

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