Lead-Free Reliability - Building It Right The First Time
Published: |
July 1, 2008 |
Author: |
Peter Biocca |
Abstract: |
As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability.... |
|
|
|
|
|
|
You must be a Company Information:
- Jul 20, 2017 - Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components
- May 17, 2017 - How to Use the Right Flux for the Selective Soldering Application
- Dec 29, 2016 - Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities
- Oct 23, 2012 - Lead-free SMT Soldering Defects How to Prevent Them
- Feb 13, 2009 - SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
- See all SMT / PCB technical articles from Kester »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Lead-Free Reliability - Building It Right The First Time article has been viewed 698 times
