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Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware

Published:

July 28, 2016

Author:

Mike Bixenman, DBA - Kyzen Corporation | Ryan Hulse, PHD - Honeywell International | Joe McChesney - CSD Automation

Abstract:

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.

Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.

The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported....

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Company Information:

KYZEN Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, USA

Cleaning

  • Phone 615-831-0888
  • Fax 615-831-0889

KYZEN Corporation website

Company Postings:

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(6) technical library articles

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