Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Published:

October 23, 2014

Author:

Dr. Mike Bixenman; Kyzen Corporation, Julie Fields; Technical Devices Company, Eric Camden; Foresite.

Abstract:

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...)

The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components...

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Company Information:

KYZEN Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, USA

Cleaning

  • Phone 615-831-0888
  • Fax 615-831-0889

KYZEN Corporation website

Company Postings:

(31) products in the catalog

(6) technical library articles

(429) news releases

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