Compatibility of Cleaning Agents With Nano-Coated Stencils

Published:

March 12, 2013

Author:

David Lober and Mike Bixenman, D.B.A.

Abstract:

High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils...

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Company Information:

KYZEN Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, USA

Cleaning

  • Phone 615-831-0888
  • Fax 615-831-0889

KYZEN Corporation website

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(6) technical library articles

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