Controlling Copper Build Up in Automatic Soldering Equipment Using Lead-Free Solder
Published: |
November 20, 2008 |
Author: |
Karl Seelig, David Suraski. |
Abstract: |
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.... |
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