Introducing the OSP Process as an Alternative to HASL
Published: |
August 9, 1999 |
Author: |
David W. Boggs, Senior Process Engineer, Merix Corporation - Viasystem |
Abstract: |
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements.... |
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