• SMTnet
  • »
  • Technical Library
  • »
  • Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

Published:

May 7, 1999

Author:

Merlin Kister, Kester Solder

Abstract:

Many manufacturers have now completed the conversion to no clean solder paste. Many factors governed this initial conversion, among those being cosmetics, solder ability, and process ability. In circuit testing or probing through no clean solder paste residues has topically not been a major factor in the conversion decision for several reasons. Due to board design, solder paste was only used on one side of the board and not subjected to testing......

  • Download Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(15) technical library articles

(47) news releases

  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Browse Technical Library »

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing article has been viewed 2691 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing
ADJUST-A-VAC Vacuum Tweezer for fragile components, wafers, MEMS devices tweezers

PCB Assembly Equipment Auctions