The Quality and Reliability of Intel's Quarter Micron Process
Published: |
May 7, 1999 |
Author: |
Krishna Seshan, Timothy J. Maloney, Kenneth J. Wu |
Abstract: |
This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability...... |
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