• SMTnet
  • »
  • Technical Library
  • »
  • Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink

Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink

Published:

June 27, 2018

Author:

J. Arrese, G. Vescio, E. Xuriguera, B. Medina-Rodriguez, A. Cornet, and A. Cirera

Abstract:

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology.

In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology...

  • Download Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Universitat de Barcelona

With 73 undergraduate programs, 273 graduate programs and 48 doctorate programs to over 63,000 students, UB is considered to be the best university in Spain in the QS World University Rankings of 2018.

Barcelona, Spain

School

  • Phone +34 934 021 100

Universitat de Barcelona website

Company Postings:

(1) technical library article

  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Apr 27, 2018 - Hot Air vs. IR BGA Rework Stations | Precision PCB Services, Inc
  • Feb 22, 2018 - Hand Soldering with Lead Free Alloys | Metcal
  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
  • Browse Technical Library »

Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink article has been viewed 231 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink
SMT, PTH, AOI, and Test machines for sale - ECM Equipment

PCB Assembly Price