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Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

Published:

May 23, 2018

Author:

Udo Welzel, Marco Braun, Stefan Scheller, Sven Issing, Harald Feufel

Abstract:

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop....

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Company Information:

Robert Bosch LLC Automotive Electronics Division

Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.

Stuttgart, Germany

Other

  • Phone +49 (0)711 400 40990
  • Fax +49 (0)711 400 40999

Robert Bosch LLC Automotive Electronics Division website

Company Postings:

(2) technical library articles

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Electronics Equipment Consignment

Plasma Prior to Conformal Coating