Deposition of Solder Paste into High Density Cavity Assemblies

Published:

February 28, 2018

Author:

Fernando Coma, Jeffrey Kennedy, Thilo Sack

Abstract:

Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates.

First published at SMTA Pan Pacific Symposium...

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Company Information:

Celestica Corporation

A multinational electronics manufacturing services (EMS) company.

Toronto, Ontario, Canada

IPC Standards Certification Center, Manufacturer of Assembled PCBs, Training Provider

  • Phone +1 416-448-5800

Celestica Corporation website

Company Postings:

(4) technical library articles

(6) news releases

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