• SMTnet
  • »
  • Technical Library
  • »
  • Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven

Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven

Published:

December 21, 2017

Author:

Rd K . Khirotdin, Nurhafizzah Hassan, Hi H. Siang, Muhamad H. Zawahid

Abstract:

The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials......

  • Download Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven  article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

University of Tun Hussein Onn

UTHM is a public university in Batu Pahat, Johor, Malaysia. It was formerly known as Institut Teknologi Tun Hussein Onn and Kolej Universiti Teknologi Tun Hussein Onn.

Johor, Malaysia

School

  • Phone +60 7-453 7000

University of Tun Hussein Onn website

Company Postings:

(1) technical library article

  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Apr 27, 2018 - Hot Air vs. IR BGA Rework Stations | Precision PCB Services, Inc
  • Feb 22, 2018 - Hand Soldering with Lead Free Alloys | Metcal
  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
  • Browse Technical Library »

Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven article has been viewed 21 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven
Manufacturing Software

Benchtop Fluid Dispenser