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Contamination Profile of Printed Circuit Board Assemblies in Relation to Soldering Types and Conformal Coating

Published:

December 11, 2017

Author:

Hélène Conseil, Morten S. Jellesen, Rajan Ambat

Abstract:

Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels....

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Company Information:

Technical University of Denmark

The Technical University of Denmark has an overall mission of developing and creating value using the natural sciences and the technical sciences to benefit society.

Lyngby, Denmark

School

  • Phone 4525 4800

Technical University of Denmark website

Company Postings:

(2) technical library articles

  • Feb 22, 2018 - Hand Soldering with Lead Free Alloys | Metcal
  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
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