• SMTnet
  • »
  • Technical Library
  • »
  • High Reliability and High Throughput Ball Bumping Process Solution - Solder Joint Encapsulant Adhesives

High Reliability and High Throughput Ball Bumping Process Solution - Solder Joint Encapsulant Adhesives

Published:

October 16, 2017

Author:

Dr. Mary Liu and Dr. Wusheng Yin

Abstract:

The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance. ...

  • Download High Reliability and High Throughput Ball Bumping Process Solution - Solder Joint Encapsulant Adhesives article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Components/Substrates, Contract Manufacturer, Manufacturer of Assembly Material

  • Phone 5184522880

YINCAE Advanced Materials, LLC. website

Company Postings:

(22) products in the catalog

(15) technical library articles

(39) news releases

  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Browse Technical Library »

High Reliability and High Throughput Ball Bumping Process Solution - Solder Joint Encapsulant Adhesives article has been viewed 293 times

  • SMTnet
  • »
  • Technical Library
  • »
  • High Reliability and High Throughput Ball Bumping Process Solution - Solder Joint Encapsulant Adhesives
soldering station

PCB, BGA Rework Services