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High Reliability and High Temperature Application Solution - Solder Joint Encapsulant Paste

Published:

October 16, 2017

Author:

Dr. Mary Liu and Dr. Wusheng Yin

Abstract:

The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail. ...

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Company Information:

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Components/Substrates, Contract Manufacturer, Manufacturer of Assembly Material

  • Phone 5184522880

YINCAE Advanced Materials, LLC. website

Company Postings:

(22) products in the catalog

(15) technical library articles

(39) news releases

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  • Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
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