Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin
Published: |
October 12, 2017 |
Author: |
David Pinsky - Raytheon Integrated Defense Systems, Tom Hester - Raytheon Space and Airborne Systems, Dr. Anduin Touw - The Boeing Company, Dave Hillman - Rockwell Collins |
Abstract: |
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.... |
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