Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components

Published:

July 20, 2017

Author:

Bruno Tolla, Ph.D., Jennifer Allen, Kyle Loomis - Kester Corporation, Mike Bixenman, DBA - KYZEN Corporation

Abstract:

As electronic devices increase functionality in smaller form factors, there will be limitations, obstacles and challenges to overcome. Advances in component technology can create issues that may have time delayed effects. One such effect is device failure due to soldering residues trapped under bottom terminated components. If the residues trapped under the component termination are active and can be mobilized with moisture, there is the potential for ion mobilization causing current leakage....

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Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(15) technical library articles

(47) news releases

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