Effects of Package Warpage on Head-in-Pillow Defect

Published:

July 6, 2017

Author:

Zhenyu Zhao1, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University, Chang Yong Park - Samsung Electronics

Abstract:

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments....

  • Download Effects of Package Warpage on Head-in-Pillow Defect article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Samsung Electronics

For over 70 years, Samsung has been dedicated to making a better world through diverse businesses. Our flagship company, Samsung Electronics, leads the global market in high-tech electronics manufacturing and digital media.

Suwon, South Korea

Manufacturer of Components

  • Phone 82-331-200-2445
  • Fax 82-331-200-2467

Samsung Electronics website

Company Postings:

(1) technical library article

(10) news releases

  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux | BEST Inc.
  • Browse Technical Library »

Effects of Package Warpage on Head-in-Pillow Defect article has been viewed 808 times

SMT Equipment Online Auctions

ADJUST-A-VAC Vacuum Tweezer for fragile components, wafers, MEMS devices tweezers