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Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly

Published:

June 13, 2017

Author:

Chris Anglin

Abstract:

The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are some of the components that must be assembled to enable these portable electronic devices. It is widely accepted that about 65% of all end of the line defects occur in the stencil printing process. Given all of the above, it is critical that a precision stencil printing process be developed to support miniaturized electronic assembly.

This paper is a summary of a significant amount of experimental data and process optimization techniques that were employed to establish a precision SMT printing process....

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Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(9) products in the catalog

(19) technical library articles

(251) news releases

  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Nov 09, 2016 - Is coating adhesion a problem? | Nordson MARCH
  • Oct 06, 2016 - PCB Laser Depanelizing Using a UV Laser | BEST Inc.
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