Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by CIMULEC


  • SMTnet
  • »
  • Technical Library
  • »
  • Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry

Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry

Published:

May 4, 2017

Author:

François Lechleiter; Cimulec, Yves Jannot; Université de Lorraine

Abstract:

Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.

After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials....

  • Download Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

CIMULEC

Manufacturer of printed circuit boards for adapted technological and innovative solutions

Ennery, France

Manufacturer of Assembled PCBs

  • Phone +33 3 87 73 86 73

CIMULEC website

Company Postings:

(1) technical library article

Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry article has been viewed 219 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry
SMT Machines

reflow oven profiler