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Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders

Published:

February 16, 2017

Author:

Thomas Sanders, Sivasubramanian Thirugnanasambandam and John Evans, Ph.D., Michael Bozack, Ph.D., Jeff Suhling, Ph.D. - Auburn University, Wayne Johnson, Ph.D. - Tennessee Tech University

Abstract:

This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.

This paper was originally published by SMTA in the Proceedings of SMTA International....

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Company Information:

Auburn University

Auburn University is a comprehensive land-grant institution with primary missions including instruction, research, and extension/outreach.

Auburn, Alabama, USA

School

  • Phone 334-844-4820
  • Fax 334-844-3307

Auburn University website

Company Postings:

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