Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Indium Corporation


  • SMTnet
  • »
  • Technical Library
  • »
  • Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Published:

February 9, 2017

Author:

Eric Bastow

Abstract:

The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.

But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question....

  • Download Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(9) products in the catalog

(18) technical library articles

(251) news releases

More SMT / PCB technical articles from Indium Corporation

Feb 06, 2014 -

Understanding SIR

Dec 27, 2013 -

Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly

Jun 05, 2013 -

Best Practices Reflow Profiling for Lead-Free SMT Assembly

Apr 11, 2013 -

No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability

Dec 20, 2012 -

Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework

Jul 27, 2012 -

Minimizing Voiding In QFN Packages Using Solder Preforms

Dec 01, 2011 -

RoHS: Five Years Later

Jun 23, 2011 -

A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

Apr 07, 2011 -

Voiding Control for QFN Assembly

Jan 27, 2011 -

Dispelling 10 Myths About Nitrogen Reflow

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? article has been viewed 647 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
Reflow Oven

PCB Assembly Equipment Auctions