Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Henkel Electronic Materials


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Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling

Published:

November 30, 2016

Author:

Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland

Abstract:

Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.

This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry....

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Company Information:

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

  • Phone 1-714-368-8000

Henkel Electronic Materials website

Company Postings:

(13) products in the catalog

(9) technical library articles

(55) news releases

More SMT / PCB technical articles from Henkel Electronic Materials

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Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Sep 23, 2010 -

Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers

Jan 06, 2010 -

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Mar 08, 2007 -

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Jul 21, 1999 -

Thermal Management of Hybrid Electronic Devices

Jul 21, 1999 -

The Effect of Solder Mask And Surface Mount Adhesive Types on a PCB Manufacturing Process.

Jul 21, 1999 -

Reliability Considerations of Electrically Conductive Adhesives.

Jul 21, 1999 -

Effects of Tg and CTE on Semiconductor Encapsulants

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