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Understanding the Effect of Process Changes and Flux Chemistry on Mid-Chip Solder Balling

Published:

November 30, 2016

Author:

Katherine Wilkerson, Ian J. Wilding, Michael Carter, Daniel Buckland

Abstract:

Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.

This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry....

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Company Information:

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

  • Phone 1-714-368-8000

Henkel Electronic Materials website

Company Postings:

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(9) technical library articles

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