• SMTnet
  • »
  • Technical Library
  • »
  • Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias

Published:

November 30, 2016

Author:

Edward Arthur; Raytheon Company, Charles Busa, Wade Goldman P.E., Alisa Grubbs; The Charles Stark Draper Laboratory, Inc.

Abstract:

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies.

The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly....

  • Download Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias article
  • To read this article you need to have Adobe PDF installed

December 2, 2016

Its a nice paper and I would have liked to pass on a few comments but the paper or presentation does not provide email contact for any of the presenters? I have had similar issues in the past with blind vias but used a different way to demonstrate and confirm the via to capture pad separation on boards Bob Willis bob@bobwillis.co.uk

You must be a registered user to talk back to us.

 
Company Information:

Raytheon

The Raytheon Company is a major American defense contractor and industrial corporation with core manufacturing concentrations in weapons and military and commercial electronics.

Waltham, Massachusetts, USA

Other

  • Phone 978-470-7238

Raytheon website

Company Postings:

(4) technical library articles

(1) news release

  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Browse Technical Library »

Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias article has been viewed 1309 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
PCB Routers

Fully automatic selective soldering stations