Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by DfR Solutions


How Mitigation Techniques Affect Reliability Results for BGAs

Published:

November 17, 2016

Author:

Greg Caswell, Melissa Keener

Abstract:

Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component....

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Company Information:

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

  • Phone 301 474-0607
  • Fax 240 757-0083

DfR Solutions website

Company Postings:

(1) product in the catalog

(17) technical library articles

(1) news release

More SMT / PCB technical articles from DfR Solutions

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Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles

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The Effect of Coating and Potting on the Reliability of QFN Devices.

Aug 07, 2014 -

Gold Embrittlement In Lead-Free Solder.

Jul 24, 2014 -

Copper Wire Bond Failure Mechanisms.

Dec 11, 2013 -

Using Physics of Failure to Predict System Level Reliability for Avionic Electronics

Jan 05, 2012 -

Conformal Coating Why, What, When, and How

Oct 27, 2011 -

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Aug 25, 2011 -

Alternative Pb-Free Alloys

Jun 02, 2011 -

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Mar 03, 2011 -

A New (Better) Approach to Tin Whisker Mitigation

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