Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Amphenol Printed Circuit Board Technology


Long Term Thermal Reliability of Printed Circuit Board Materials

Published:

September 15, 2016

Author:

Eva McDermott, Ph.D., Bob McGrath, and Christine Harrington

Abstract:

This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliability data for printed wiring board (PWB) materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions. Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown / degradation of the composite printed circuit board material and mechanical structure over time and temperature for mission critical applications....

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Company Information:

Amphenol Printed Circuit Board Technology

AAPC is a world leader in the printed circuit industry, building PCB's, Backplanes, Flex and Rigid Flex products to meet our customers demanding needs.

Nashua, New Hampshire, USA

Contract Manufacturer, Manufacturer of Assembled PCBs, Service Provider

  • Phone 1-603-324-4500

Amphenol Printed Circuit Board Technology website

Company Postings:

(1) technical library article

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