Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Flex (Flextronics International)


Reliability Study of Low Silver Alloy Solder Pastes

Published:

September 1, 2016

Author:

Jennifer Nguyen, David Geiger and Murad Kurwa

Abstract:

Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.

In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included....

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Company Information:

Flex (Flextronics International)

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Design, Service Provider

  • Phone 65 6890 7188
  • Fax 65 6543 1888

Flex (Flextronics International) website

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