Nanocopper Based Paste for Solid Copper Via Fill

Published:

March 3, 2016

Author:

David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials, Sunny Patel; Candor Industries.

Abstract:

This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias....

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Company Information:

Intrinsiq Materials manufactures a variety of electronic ink, including screen-printable, and inkjetable copper ink, a silicon ink jet, and a nickel ink jet.

Rochester, New York, USA

Manufacturer

  • Phone +1 (585) 301 4432

See Company Website »

Company Postings:

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