Embedded Fibers Enhance Nano-Scale Interconnections

Published:

September 3, 2015

Author:

V. Desmaris, S. Shafiee, A. Saleem, A. Johansson and P. Marcoux

Abstract:

While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced. This paper will introduce the use of embedded fibers in the interconnections as a means of addressing these issues....

  • Download Embedded Fibers Enhance Nano-Scale Interconnections article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Smoltek offers a proprietary conductive nano-scale carbon technology tailored to support the future needs of the semiconductor industry.

Gothenburg, Sweden

Other

  • Phone +46 (0)760-520053

See Company Website »

Company Postings:

(1) technical library article

  • Mar 19, 2024 - What is Underfill | GPD Global
  • Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Browse Technical Library »

Embedded Fibers Enhance Nano-Scale Interconnections article has been viewed 554 times

Fluid Dispensing, Staking, TIM, Solder Paste

Jade Series Selective Soldering Machines