Failure Modes in Wire bonded and Flip Chip Packages

Published:

December 11, 2014

Author:

Mumtaz Y. Bora

Abstract:

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...)

The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared...

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Company Information:

Peregrine Semiconductor

A leading fabless provider of high-performance, radio frequency integrated circuits, or RFICs.

San Diego, California, USA

Manufacturer of Components

  • Phone 858-731-9400
  • Fax 858-731-9499

Peregrine Semiconductor website

Company Postings:

(2) technical library articles

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  • Mar 30, 2017 - Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework | BEST Inc.
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