Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs
Published: |
October 16, 2014 |
Author: |
Rama Hegde, senior member of technical staff; Freescale Semiconductor. |
Abstract: |
Key points are: *Long-term storage of BGA & QFP products may be required due to:
* Integrity of EOL products in terms of solderability needs to be verified.... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs article has been viewed 678 times
