Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill
Published: |
January 2, 2014 |
Author: |
Bankeem Chheda and S. Manian Ramkumar, Ph.D.; Rochester Institute of Technology-CEMA, Reza Ghaffarian; Ph.D. Jet Propulsion Laboratory. |
Abstract: |
With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.... |
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