Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers
Published: |
October 11, 2012 |
Author: |
Mustafa Özkök, Joe McGurran, Dieter Metzger, Hugh Roberts |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P... |
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