Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures
Published: |
January 12, 2012 |
Author: |
Ronak Varia, Xuejun Fan |
Abstract: |
In this paper, hollowed solder ball structures in wafer level packages are investigated. Detailed 3-D finite element modelling is conducted for stress and accumulated inelastic strain energy density or creep strain analysis. Three cases are studied in thi... |
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