Ground Pours - To Pour Or Not To Pour?

Published:

February 17, 2011

Author:

Barry Olney

Abstract:

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...

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In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

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