Nanofluids, Nanogels and Nanopastes for Electronic Packaging
Published: |
December 22, 2010 |
Author: |
Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich |
Abstract: |
This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from i3 Electronics »
- Mar 13, 2023 - Printable Electronics: Towards Materials Development And Device Fabrication
- Aug 14, 2014 - Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization.
- May 05, 2011 - Manufacturing Substrates with Embedded Passives
- Oct 28, 2010 - Organic Optical Waveguide Fabrication in a Manufacturing Environment
- Aug 05, 2010 - PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements
- See all SMT / PCB technical articles from i3 Electronics »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Nanofluids, Nanogels and Nanopastes for Electronic Packaging article has been viewed 836 times
