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Head-in-Pillow BGA Defects

Published:	November 5, 2009
Author:	AIM
Abstract:	Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but l...


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Head-in-Pillow BGA Defects

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