A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms
Published: |
October 14, 2009 |
Author: |
Elissa Bumiller and Dr. Craig Hillman |
Abstract: |
Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)... |
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