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A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms

Published:	October 14, 2009
Author:	DfR Solutions
Abstract:	Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias [1]. ECM, also known as dendritic growth, is a critical issu...


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