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Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure
Credit/Source: Endicott Interconnect Technologies
Posted on October 8, 2009
Embedded passives account for a very large part of
today’s electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more...
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