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Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure
Published:
October 8, 2009
Author:
Endicott Interconnect Technologies
Abstract:
Embedded passives account for a very large part of
today’s electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more...
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