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Optimizing Batch Cleaning Process Parameters for Removing Lead-Free Flux Residues on Populated Circuit Assemblies

Published:

September 18, 2009

Author:

Steve Stach, Austin American Corporation, Mike Bixenman, Kyzen Corporation

Abstract:

Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on populated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs....

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Company Information:

Austin American Technology engineers and manufactures high performance cleaning systems. Our systems include batch and inline; aqueous and solvent; spray in air and spray under immersion with ultrasonics.

Burnet, Texas, USA

Manufacturer

  • Phone 512-756-4150 x34
  • Fax 512-756-5150

See Company Website »

Company Postings:

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