Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies
Published: |
January 21, 2009 |
Author: |
Dirk Ellis |
Abstract: |
This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements.... |
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