• SMTnet
  • »
  • Technical Library
  • »
  • Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Published:

January 15, 2009

Author:

Peter Biocca, Senior Market Development Engineer, Kester.

Abstract:

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations....

  • Download Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(15) technical library articles

(47) news releases

  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Jun 01, 2017 - Evaluating the Effects of Plasma Treatment prior to Conformal Coating on Electronic Assemblies to Enhance Conformity of Coverage | Nordson MARCH
  • Mar 30, 2017 - Multiple Methods for Applying Paste Flux or Solder Paste for BGA Rework | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Browse Technical Library »

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences article has been viewed 1380 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences
Plasma Prior to Conformal Coating

Jetting Pump for Integration