Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Kester


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Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Published:

January 15, 2009

Author:

Peter Biocca, Senior Market Development Engineer, Kester.

Abstract:

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations....

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Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(13) technical library articles

(38) news releases

More SMT / PCB technical articles from Kester

Dec 29, 2016 -

Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities

Oct 23, 2012 -

Lead-free SMT Soldering Defects How to Prevent Them

Feb 13, 2009 -

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Jul 01, 2008 -

Lead-Free Reliability - Building It Right The First Time

Jan 03, 2008 -

Developing a Reliable Lead-free SMT Process

Nov 15, 2007 -

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

May 07, 1999 -

Manufacturing Considerations When Implementing Voc-Free Flux Technology

May 07, 1999 -

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

May 07, 1999 -

Soldering to Gold Over Nickel Surfaces

May 07, 1999 -

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

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