Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by Kester


Lead-Free Reliability - Building It Right The First Time

Published:

July 1, 2008

Author:

Peter Biocca

Abstract:

As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability....

  • Download Lead-Free Reliability - Building It Right The First Time article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

  • Phone +1 800.2.KESTER
  • Fax +1 630.616.4044

Kester website

Company Postings:

(5) products in the catalog

(1) upcoming event

(13) technical library articles

(47) news releases

More SMT / PCB technical articles from Kester

Dec 29, 2016 -

Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities

Oct 23, 2012 -

Lead-free SMT Soldering Defects How to Prevent Them

Feb 13, 2009 -

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Jan 15, 2009 -

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Jan 03, 2008 -

Developing a Reliable Lead-free SMT Process

Nov 15, 2007 -

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

May 07, 1999 -

Manufacturing Considerations When Implementing Voc-Free Flux Technology

May 07, 1999 -

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

May 07, 1999 -

Soldering to Gold Over Nickel Surfaces

May 07, 1999 -

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

Lead-Free Reliability - Building It Right The First Time article has been viewed 1508 times

Reflow Oven

Facility Closure