Printable Nanocomposites for Electronic Packaging
Published: |
June 25, 2008 |
Author: |
Endicott Interconnect Technologies, Inc. |
Abstract: |
Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from i3 Electronics »
- Mar 13, 2023 - Printable Electronics: Towards Materials Development And Device Fabrication
- Aug 14, 2014 - Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization.
- May 05, 2011 - Manufacturing Substrates with Embedded Passives
- Dec 22, 2010 - Nanofluids, Nanogels and Nanopastes for Electronic Packaging
- Oct 28, 2010 - Organic Optical Waveguide Fabrication in a Manufacturing Environment
- See all SMT / PCB technical articles from i3 Electronics »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Printable Nanocomposites for Electronic Packaging article has been viewed 618 times