Laser Direct Imaging of Tracks on PCB Covered With Laser Photoresist

Published:

April 15, 2008

Author:

R. Barbucha, M. Kocik, J. Mizeraczyk , 2, G. Kozioł, and J. Borecki, Polish Academy of Sciences

Abstract:

The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges....

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Company Information:

Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences

The mission of Unipress is to use high pressure methods for advanced fundamental research and technology development. The main fields: Solid state physics, Optoelectronics, Sintering of nanocrystalline materials...

Warsaw, Poland

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