Liquid Tin Corrosion and Lead Free Wave Soldering
Published: |
February 12, 2008 |
Author: |
Jim Morris, Speedline Technologies, Matthew J. O’Keefe, Ph.D., University of Missouri |
Abstract: |
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.... |
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