Selective Soldering Process

Published:

January 24, 2008

Author:

Paul Bratt, Lead Package Engineer

Abstract:

Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components. Often, there are interconnect hardware, displays, or other components that cannot withstand the exposure to the high temperature involved in the wave soldering process. They are generally soldered by hand. The challenge is to determine the optimal method manufacturers can use to solder these boards populated with mixed technology....

  • Download Selective Soldering Process article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, USA

Other

  • Phone (610) 362-1320
  • Fax (610) 362-1290

See Company Website »

Company Postings:

(6) technical library articles

  • Mar 19, 2024 - What is Underfill | GPD Global
  • Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Browse Technical Library »

Selective Soldering Process article has been viewed 650 times

Jade Series Selective Soldering Machines

Solder Paste Dispensing